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Samsung patents steam-based machine for heating electronic components

Samsung has filed a patent for a machine that uses heated steam to melt solder on electronic circuit boards. The device features a chamber filled with vapor and a movable platform that holds the board, with a cover that directs the steam flow onto the solder joints.

Why it mattersThis is a specific improvement to factory equipment that helps ensure electronic parts are assembled correctly, but it does not affect how consumers use their devices.

In the filing’s own words

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated, a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber, a substrate stage installed to be movable upward and downward in the vapor generating chamber, the substrate stage having a seating surface on which a substrate on which solder members are attached is seated, and an airflow control cover disposed on the substrate stage above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members.

What exactly they claim (claim 1)

1. A solder reflow apparatus, comprising: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber; a substrate stage installed to be movable upward and downward in the vapor generating chamber, the substrate stage having a seating surface on which a substrate on which solder members are attached is seated; and an airflow control cover disposed on the substrate stage above the solder members, the airflow control cover including a plurality of vapor passage holes through which air is allowed to flow toward the solder members.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
US20260282943A1
Application number
19670215
Filed
May 7, 2026
Published
Sep 17, 2026
Inventors
2
Claims
20

Classified under

H10W 70/093 Electricity & electronicsB23K 1/012 Operations & transportH10P 72/0434 Electricity & electronicsH10W 70/098 Electricity & electronicsB23K 2101/40 Operations & transport
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.