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Samsung patents method to recover silicon from semiconductor wastewater

Samsung describes a process that uses electrical forces to clump tiny silicon particles together in wastewater, making them easier to filter out. The collected material is then pressed and dried into a powder that can be purified and reused in new chips or batteries.

Why it mattersThis approach could help reduce waste in chip factories and lower the cost of producing new silicon materials by reusing what is currently discarded.

In the filing’s own words

A method is provided for recycling silicon from wastewater generated during semiconductor processing. The method includes coagulating silicon particles in the wastewater using a dielectrophoresis device to increase particle size, forming a silicon slurry with a microfiltration device, pressing the slurry to form a silicon cake, and drying the cake in a fluidized bed reactor to obtain silicon powder. The process enables efficient recovery of high-purity silicon using filters with relatively large pores, thereby reducing filter damage from heat generation and improving recovery yield. The recovered silicon powder may be further analyzed, purified of metal impurities, and recycled as a raw material for semiconductor wafers, silicon carbide power devices, or negative electrode materials for rechargeable batteries. This method provides both economic and environmental benefits by securing high-purity silicon materials from otherwise discarded wastewater.

What exactly they claim (claim 1)

1. A method for recycling silicon from wastewater, comprising: coagulating silicon particles in the wastewater using a dielectrophoresis device; forming a silicon powder using the coagulated silicon particles; and recovering the silicon powder.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
METHOD FOR RECYCLING SILICON IN WASTEWATER
Publication number
US20260265092A1
Application number
19349466
Filed
Oct 3, 2025
Published
Sep 10, 2026
Inventors
8
Claims
20

Classified under

C02F 1/4696 Chemistry & metalsC01B 33/021 Chemistry & metalsC02F 1/444 Chemistry & metalsC01P 2006/40 Chemistry & metalsC02F 2101/10 Chemistry & metalsC02F 2103/346 Chemistry & metals

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.