Samsung patents chip package design with specific metal layers
Samsung has filed a patent for a specific way to build semiconductor packages, which are the protective housings for computer chips. The design uses a metal structure called an under bump metallization that passes through a protective layer to connect the chip to external pins. It also includes a redistribution structure that sits on top of this metal to help route electrical signals to the chip.
In the filing’s own words
The present disclosure provides a semiconductor package including a passivation layer; an under bump metallization including a seed layer and a conductive layer disposed on the seed layer, penetrating the passivation layer and extending onto the upper surface of the passivation layer; an external connection terminal disposed on the lower surface of the above under bump metallization; a redistribution structure disposed on the upper surface of the passivation layer and covering the under bump metallization; and a semiconductor chip disposed on the upper surface of the above redistribution structure. The seed layer includes a first region disposed between the external connection terminal and the conductive layer and a second region disposed between the passivation layer and the conductive layer.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a passivation layer; an under bump metallization including a seed layer and a conductive layer disposed on the seed layer, the under bump metallization penetrating the passivation layer and extending onto an upper surface of the passivation layer; an external connection terminal disposed on a lower surface of the under bump metallization; a redistribution structure disposed on the upper surface of the passivation layer and covering the under bump metallization; and a semiconductor chip disposed on an upper surface of the redistribution structure, wherein the seed layer includes a first region disposed between the external connection terminal and the conductive layer and a second region disposed between the passivation layer and the conductive layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION
- Publication number
- US20260334338A1
- Application number
- 19347889
- Filed
- Oct 2, 2025
- Published
- Oct 22, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 90/701 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 70/66 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.