Samsung patents faster chip testing using machine learning
Samsung describes a method to speed up the testing of electronic components by measuring signal stability at two different speeds. It uses machine learning to predict how those signals behave at other speeds, reducing the need for extensive manual testing.
In the filing’s own words
Provided is a training method capable of reducing or minimizing a training time. The training method includes, for each of devices to be tested, calculating a first eye width at which a first signal and a second signal synchronize with each other at a first operation speed, and calculating a second eye width at which the first signal and the second signal synchronize with each other at a second operation speed different from the first operation speed; performing machine learning on the first eye width and the second eye width to derive a model showing a relation between operation speeds and eye widths; and calculating a third eye width corresponding to a third operation speed different from the first operation speed and the second operation speed, using the model.
What exactly they claim (claim 1)
1. A training method comprising: for each of first devices to be tested, calculating a first eye width at which a first signal and a second signal synchronize with each other at a first operation speed, and calculating a second eye width at which the first signal and the second signal synchronize with each other at a second operation speed different from the first operation speed; deriving a model showing a relation between operation speeds and eye widths by performing machine learning on the first eye width and the second eye width; and using the model to calculate a third eye width corresponding to a third operation speed different from the first operation speed and the second operation speed.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Training method and test apparatus using the same
- Patent number
- US12724068B2
- Application number
- 18158181
- Filed
- Jan 23, 2023
- Granted
- Sep 1, 2026
- Inventors
- 2
- Claims
- 20
Classified under
G01R 31/31726 Physics & computingG01R 31/31937 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.