Samsung patents chip stack design with two different gap fillers
Samsung describes a semiconductor package that stacks two chips on top of each other using redistribution layers. The design uses two distinct filling materials: one between the chip and its base, and another between the top chip and a separate heat-dissipation part.
In the filing’s own words
A semiconductor package according to some example embodiments of the present disclosure includes: a first redistribution structure; a first semiconductor chip structure on the first redistribution structure; a second redistribution structure on the first semiconductor chip structure; a second semiconductor chip structure on the second redistribution structure; a first filling layer between the second redistribution structure and the second semiconductor chip structure; a heat dissipation member on the second redistribution structure and spaced apart from the second semiconductor chip structure in a first direction; and a gap filling layer between the second semiconductor chip structure and the heat dissipation member, and the first filling layer and the gap filling layer include different materials.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a first redistribution structure; a first semiconductor chip structure on the first redistribution structure; a second redistribution structure on the first semiconductor chip structure; a second semiconductor chip structure on the second redistribution structure; a first filling layer between the second redistribution structure and the second semiconductor chip structure; a heat dissipation member on the second redistribution structure, wherein the heat dissipation member is spaced apart from the second semiconductor chip structure in a first direction; and a gap filling layer between the second semiconductor chip structure and the heat dissipation member, wherein a material of the first filling layer is different from a material of the gap filling layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING GAP FILLING LAYER
- Publication number
- US20260334291A1
- Application number
- 19351432
- Filed
- Oct 7, 2025
- Published
- Oct 22, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 74/121 Electricity & electronicsH10W 40/251 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 74/476 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/401 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.