Samsung patents chip package design to move heat away from stacked processors
Samsung describes a semiconductor package where a larger chip sits under a smaller one, with a special heat-spreading structure placed on the interposer board. This structure is positioned specifically under the larger chip to help move heat away from the area where the two chips are stacked.
In the filing’s own words
A semiconductor package including comprising a first package including a lower die, an upper die stacked on the lower die, and a first thermal interface material (TIM) disposed on the upper die, an interposer disposed on the first package and including a first area and a second area arranged along a first direction, a second package disposed on the second area, and a thermal diffusion structure disposed on the first area and not disposed on the second area, an area of the lower die being greater than an area of the upper die, an area of the first TIM being substantially the same as the area of the upper die, and the lower die being disposed in the first package to overlap the first area more than the second area, such that heat generated from the lower die is discharged through the thermal diffusion structure.
What exactly they claim (claim 1)
1 - 20. (canceled)
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number
- US20260334288A1
- Application number
- 19645004
- Filed
- Apr 10, 2026
- Published
- Oct 22, 2026
- Inventors
- 4
- Claims
- 21
Classified under
H10W 74/117 Electricity & electronicsH10W 72/20 Electricity & electronicsH10W 72/30 Electricity & electronicsH10W 72/50 Electricity & electronicsH10W 72/851 Electricity & electronicsH10W 74/016 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.