Samsung patents chip design with specific insulating layers and bonding patterns
Samsung has filed a patent application for a semiconductor device structure that uses a substrate with distinct regions. The design features an insulating layer with specific trenches and recesses, along with a liner layer and a bonding pattern to connect components.
In the filing’s own words
A semiconductor device may include a first substrate including a first region and a second region, a first insulating layer on the first substrate, the first insulating layer having a first surface and a second surface, the first surface being adjacent to the first substrate and the second surface being opposite the first surface, the first insulating layer including a first trench on the first region and a first recess on the second region, the first recess being recessed from the second surface of the first insulating layer, a first insulating liner layer on the second surface of the first insulating layer, the first insulating liner layer extending onto an inner surface of the first recess, and a first bonding pattern in the first trench.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a first substrate including a first region and a second region; a first insulating layer on the first substrate, the first insulating layer having a first surface and a second surface, the first surface being adjacent to the first substrate and the second surface being opposite the first surface, the first insulating layer including a first trench on the first region and a first recess on the second region, the first recess being recessed from the second surface of the first insulating layer; a first insulating liner layer on the second surface of the first insulating layer, the first insulating liner layer extending onto an inner surface of the first recess; and a first bonding pattern in the first trench.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING INSULATING LAYERS AND METHOD FOR MANUFACTURING THE SAME
- Publication number
- US20260334284A1
- Application number
- 19540965
- Filed
- Feb 16, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10W 72/967 Electricity & electronicsH10W 72/934 Electricity & electronicsH10W 72/936 Electricity & electronicsH10W 72/9445 Electricity & electronicsH10W 72/963 Electricity & electronicsH10W 90/792 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.