Samsung patents chip stacking method using angled semiconductor layers
Samsung has filed a patent for a semiconductor package that stacks chips at different heights to create an inclined profile. The design places a second and third chip above a base package, where the vertical distance from the base to the top of each chip changes based on their horizontal position. This arrangement allows for a specific geometric layout of the components within the package.
In the filing’s own words
A semiconductor package may include: a first package including a first chip; a second chip above the first package in a first direction intersecting with an upper surface of the first package; and a third chip above the first package, the third chip spaced apart from the second chip in a second direction intersecting with the first direction. A height, in the first direction, from the upper surface of the first package to an upper surface of the second chip decreases with decreasing distance to the third chip in the second direction, and a height, in the first direction, from the upper surface of the first package to an upper surface of the third chip increases with increasing distance from the second chip in the second direction.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a first package comprising a first chip; a second chip above the first package in a first direction intersecting with an upper surface of the first package; and a third chip above the first package, the third chip spaced apart from the second chip in a second direction intersecting with the first direction, wherein a height, in the first direction, from the upper surface of the first package to an upper surface of the second chip decreases with decreasing distance to the third chip in the second direction, and wherein a height, in the first direction, from the upper surface of the first package to an upper surface of the third chip increases with increasing distance from the second chip in the second direction.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING INCLINED CHIPS AND METHOD OF FABRICATING THE SAME
- Publication number
- US20260334276A1
- Application number
- 19441159
- Filed
- Jan 6, 2026
- Published
- Oct 22, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 72/227 Electricity & electronicsH10W 72/257 Electricity & electronicsH10W 90/22 Electricity & electronicsH10W 90/401 Electricity & electronicsH10W 90/724 Electricity & electronicsH10B 80/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.