Samsung patents chip design with power lines on the back side
Samsung describes a method for building computer chips where the power supply wires are placed on the back side of the silicon instead of the front. This design uses a bonding layer to connect these back-side power lines to the transistors, which are located in the front section of the chip.
In the filing’s own words
An integrated circuit includes a first back-end-of-line (BEOL) region including a back-side power delivery network (BSPDN, a front-end-of-line (FEOL) region including a plurality of transistors, a second BEOL region including signal patterns configured to apply signals to the plurality of transistors, and a bonding layer in contact with one surface of the second BEOL region, wherein the integrated circuit includes a plurality of cells including a first cell, and the first cell includes at least one through via connected to the FEOL region.
What exactly they claim (claim 1)
1. An integrated circuit comprising a back-side power delivery network (BSPDN), the integrated circuit comprising: a first back-end-of-line (BEOL) region comprising the BSPDN; a front-end-of-line (FEOL) region comprising a plurality of transistors; a second BEOL region comprising signal patterns configured to apply signals to the plurality of transistors; a bonding layer in contact with a first surface of the second BEOL region; and wherein the integrated circuit comprises a plurality of cells including a first cell, wherein the first cell comprises at least one through via connected to the FEOL region.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- INTEGRATED CIRCUIT AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT
- Publication number
- US20260334214A1
- Application number
- 19574679
- Filed
- Mar 23, 2026
- Published
- Oct 22, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 20/481 Electricity & electronicsH10W 20/2134 Electricity & electronicsH10W 20/496 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.