Samsung patents chip design with recessed hole for better connections
Samsung describes a semiconductor chip design where a hole passes through the chip and its protective layer to connect with a metal pad. The filing specifies that the top of this hole is recessed, or set back, within the protective layer to help the metal connection form properly. This structure aims to improve how electrical signals move through the chip's internal wiring.
In the filing’s own words
A semiconductor chip may include: a chip substrate including a first surface and a second surface opposite to the first surface; a passivation layer on the second surface of the chip substrate; a through via penetrating the chip substrate and the passivation layer; a chip pad on the through via and the passivation layer; and a seed layer between the through via and the chip pad and between the passivation layer and the chip pad. The passivation layer may include an etching region in which the through via is located, and an upper surface of the etching region of the passivation layer may be recessed.
What exactly they claim (claim 1)
1. A semiconductor chip comprising: a chip substrate comprising a first surface and a second surface opposite to the first surface; a passivation layer on the second surface of the chip substrate; a through via penetrating the chip substrate and the passivation layer; a chip pad on the through via and the passivation layer; and a seed layer between the through via and the chip pad and between the passivation layer and the chip pad, wherein the passivation layer comprises an etching region in which the through via is located, and wherein an upper surface of the etching region of the passivation layer is recessed.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR CHIP INCLUDING THROUGH VIA
- Publication number
- US20260334212A1
- Application number
- 19648781
- Filed
- Apr 15, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10W 20/45 Electricity & electronicsH10W 20/211 Electricity & electronicsH10W 20/43 Electricity & electronicsH10W 72/942 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.