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Samsung patents laser method for cutting semiconductor test samples

Patent drawing
Patent drawing from the official filing.

Samsung describes a technique for creating small test pieces from a full, uncut silicon wafer using a laser beam. The process involves adding a protective coating, using the laser to remove specific sections of the wafer and coating, and then cleaning away any remaining material.

Why it mattersThis is a routine manufacturing improvement that helps engineers create precise test samples to check chip quality during production.

In the filing’s own words

Provided is a method of manufacturing a sample, the method including preparing an uncut wafer, and manufacturing a sample by emitting a laser beam onto the uncut wafer, wherein the manufacturing of the sample includes forming a passivation layer on the wafer, removing at least a portion of each of the wafer and the passivation layer, and removing a residual passivation layer.

What exactly they claim (claim 1)

1. A method of manufacturing a sample, the method comprising: preparing an uncut wafer; and manufacturing a sample by emitting a laser beam onto the uncut wafer, wherein the manufacturing of the sample comprises: forming a passivation layer on the wafer; removing at least a portion of each of the wafer and the passivation layer; and removing a residual passivation layer.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
APPARATUS AND METHOD OF MANUFACTURING SAMPLE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE APPARATUS AND METHOD
Publication number
US20260334166A1
Application number
19468474
Filed
Feb 3, 2026
Published
Oct 22, 2026
Inventors
4
Claims
20

Classified under

H10P 74/203 Electricity & electronicsB23K 26/032 Operations & transportB23K 26/042 Operations & transportB23K 26/364 Operations & transportH10P 54/20 Electricity & electronicsH10P 54/92 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.