Samsung patents method for depositing thin layers using surfactants
Samsung describes a technique for creating thin coatings on materials like silicon wafers. The process involves mixing a coating material with a surfactant, heating the mixture to separate them, and then removing the surfactant to leave a pure layer.
In the filing’s own words
A method for depositing a layer on a substrate is disclosed. The method may include forming a first layer on a substrate, where the first layer may include a surfactant and a first material having a higher surface energy than the substrate, and the forming of the first layer on the substrate may include applying the first material and the surfactant on the substrate, annealing the first layer to segregate the surfactant from the first material of the first layer, and removing the surfactant from the first layer.
What exactly they claim (claim 1)
1. A method comprising: forming a first layer on a substrate, the first layer comprising a surfactant and a first material having a higher surface energy than the substrate, wherein the forming of the first layer on the substrate comprises applying the first material and the surfactant on the substrate; annealing the first layer to segregate the surfactant from the first material of the first layer; and removing the surfactant from the first layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SYSTEMS AND METHODS FOR LAYER FORMATION
- Publication number
- US20260334086A1
- Application number
- 19361386
- Filed
- Oct 17, 2025
- Published
- Oct 22, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10N 50/01 Electricity & electronicsG11C 11/161 Physics & computingH10N 50/10 Electricity & electronicsH10N 50/85 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.