Samsung patents chip design that stacks power connections vertically
Samsung describes a semiconductor device where two different types of transistors are built side-by-side on a chip. The design uses vertical power lines connected to the top and bottom of the transistor components to manage electricity flow.
In the filing’s own words
A semiconductor device according to embodiments includes: a substrate; a first channel structure and a second channel structure on the substrate; a gate structure surrounding the first channel structure and the second channel structure; first source/drain patterns connected to opposite sides of the first channel structure and including an N-type impurity; second source/drain patterns connected to opposite sides of the second channel structure and including a P-type impurity; a first power rail connected to an upper region of one of the first source/drain patterns; a second power rail connected to a lower region of the one of the first source/drain patterns; and a third power rail connected to an upper region or a lower region of one of the second source/drain patterns.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate; a first channel structure and a second channel structure on the substrate; a gate structure surrounding the first channel structure and the second channel structure; first source/drain patterns connected to opposite sides of the first channel structure and including an N-type impurity; second source/drain patterns connected to opposite sides of the second channel structure and including a P-type impurity; a first power rail connected to an upper region of one of the first source/drain patterns; a second power rail connected to a lower region of the one of the first source/drain patterns; and a third power rail connected to an upper region or a lower region of one of the second source/drain patterns.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE
- Publication number
- US20260333856A1
- Application number
- 19350620
- Filed
- Oct 6, 2025
- Published
- Oct 22, 2026
- Inventors
- 7
- Claims
- 20
Classified under
H10D 84/851 Electricity & electronicsH10D 84/0186 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.