Samsung patents angled chip layout with diamond-shaped metal fillers
Samsung describes a method for making memory chips where the underlying active areas are angled relative to the standard grid. The design uses diamond-shaped metal patterns in the center of these areas to connect the data lines, which run perpendicular to the control gates.
In the filing’s own words
A method of manufacturing a semiconductor device includes forming an active pattern on a substrate to extend in a third direction having an acute angle with respect to a first direction and a second direction, the first direction and the second direction being substantially parallel to an upper surface of the substrate and substantially perpendicular to each other, forming a gate structure in an upper portion of the active pattern to extend in the first direction, forming a conductive filling pattern on an upper surface of a central portion of the active pattern to have a shape of a parallelogram in a plan view, and forming a bit line structure on the conductive filling pattern to extend in the second direction.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor device, the method comprising: forming an active pattern on a substrate to extend in a third direction having an acute angle with respect to a first direction and a second direction, the first direction and the second direction being substantially parallel to an upper surface of the substrate and substantially perpendicular to each other; forming a gate structure in an upper portion of the active pattern to extend in the first direction; forming a conductive filling pattern on an upper surface of a central portion of the active pattern to have a shape of a parallelogram in a plan view; and forming a bit line structure on the conductive filling pattern to extend in the second direction.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE FILLING PATTERN
- Publication number
- US20260333669A1
- Application number
- 19720076
- Filed
- Jun 25, 2026
- Published
- Oct 22, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10B 12/315 Electricity & electronicsH10B 12/34 Electricity & electronicsH10B 12/482 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.