Samsung patents induction cooktop with split airflow for cooling
Samsung has filed a patent for an induction cooking device that uses a cooling fan to manage heat from the internal circuitry. The design features a split air path that directs some airflow to cool the main electronics while routing a separate stream to keep the user interface comfortable.
In the filing’s own words
An induction heating cooking device comprising a plate to allow a cooking container to be placed thereon; a heating device configured to heat the cooking container by receiving a driving current from a printed circuit board; and a user interface to receive a user input for operating the heating device. In addition, the induction heating cooking device comprises: a heat dissipation member disposed below the user interface and provided to be able to exchange heat with the printed circuit board; and a cooling fan provided to generate an air flow to cool the heat dissipation member. In addition, the induction heating cooking device comprises a branch guide, including a first flow path and a second flow path, to guide a portion of the air flow generated by the cooling fan to the user interface, where the second flow path is disposed above and separated from the first flow path such that air to cool the heat dissipation member flows through the first flow path.
What exactly they claim (claim 1)
1. An induction heating cooking device comprising: a plate to allow a cooking container to be placed thereon; a heating device configured to heat the cooking container by receiving a driving current from a printed circuit board; and a user interface to receive a user input for operating the heating device; a heat dissipation member, to be disposed below the user interface, configured to exchange heat with the printed circuit board; a cooling fan configured to generate an airflow to cool the heat dissipation member; and a branch guide, including a first flow path and a second flow path, to guide a portion of the airflow generated by the cooling fan to the user interface, wherein the second flow path is disposed above and separated from the first flow path such that air to cool the heat dissipation member flows through the first flow path.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- INDUCTION HEATING COOKING DEVICE
- Publication number
- US20260333617A1
- Application number
- 19712826
- Filed
- Jun 18, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 15
Classified under
H05K 7/20154 Electricity & electronicsH05B 6/1209 Electricity & electronicsH05K 7/20145 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
