Samsung patents focus ring design for easier chip machine maintenance
Samsung has filed a patent for a specific shape of a 'focus ring,' a part used in machines that make computer chips. The design features two different inner surfaces that help the machine's holding plate slide into place and align correctly during routine maintenance.
In the filing’s own words
A semiconductor fabrication method includes loading a substrate on an electrostatic chuck structure, performing a semiconductor process, removing the substrate from the electrostatic chuck structure and replacing a focus ring, where the focus ring has a central axis that extends in a first direction, an inner lateral surface of the focus ring includes a first inner lateral surface and a second inner lateral surface that extends from the first inner lateral surface, and replacing the focus ring includes contacting the electrostatic chuck structure with at least a portion of the second inner lateral surface of the focus ring and aligning a center of the electrostatic chuck structure with the central axis of the focus ring.
What exactly they claim (claim 1)
1. A semiconductor fabrication method, comprising: loading a substrate on an electrostatic chuck structure; performing a semiconductor process; removing the substrate from the electrostatic chuck structure; and replacing a focus ring, wherein the focus ring has a central axis that extends in a first direction, wherein an inner lateral surface of the focus ring comprises a first inner lateral surface and a second inner lateral surface that extends from the first inner lateral surface, and wherein replacing the focus ring comprises contacting the electrostatic chuck structure with at least a portion of the second inner lateral surface of the focus ring and aligning a center of the electrostatic chuck structure with the central axis of the focus ring.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME
- Publication number
- US20260331434A1
- Application number
- 19723945
- Filed
- Jun 29, 2026
- Published
- Oct 22, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H01J 37/32642 Electricity & electronicsH10P 72/72 Electricity & electronicsH10P 72/7612 Electricity & electronicsH10P 72/7624 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.