Samsung patents method for generating chip patterns from design rules
Samsung has filed a patent application for a system that helps create images for making computer chips. The method converts specific design rules and potential weaknesses into mathematical vectors to generate patterns that meet those requirements.
In the filing’s own words
A device including one or more processors including processing circuitry and a memory including one or more storage media storing instructions that, when executed individually or collectively by the one or more processors, cause the electronic device to convert a patterning vulnerability into a first vector, convert a design rule into a second vector, and generate one or more pattern images to satisfy the patterning vulnerability and the design rule based on the first vector and the second vector.
What exactly they claim (claim 1)
1. An electronic device, comprising: one or more processors comprising processing circuitry; and a memory comprising one or more storage media storing instructions that, when executed individually or collectively by the one or more processors, cause the electronic device to: convert a patterning vulnerability into a first vector; convert a design rule into a second vector; and generate one or more pattern images to satisfy the patterning vulnerability and the design rule based on the first vector and the second vector.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- METHOD, DEVICE, AND SYSTEM WITH SEMICONDUCTOR PATTERN IMAGE GENERATION
- Publication number
- US20260330118A1
- Application number
- 19468124
- Filed
- Feb 3, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 20
Classified under
G06F 30/392 Physics & computingG03F 7/70433 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
