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SamsungPatent applicationChips & hardwareInterest 6/10

Samsung patents chip package that connects light and electronics

Patent drawing
Patent drawing from the official filing.

Samsung describes a semiconductor package that stacks an electronic chip on top of a photonic chip, which uses light instead of electricity to move data. An adhesive film holds an optical block in place, with small openings that allow light to pass through to connect the components.

Why it mattersThis design could help build faster computer chips by combining light-based and electrical circuits in a single compact package.

In the filing’s own words

A semiconductor package may include: a photonic integrated circuit (PIC) chip; an electronic integrated circuit (EIC) chip on the PIC chip in a first direction; an optical path block adjacent to the EIC chip in a second direction intersecting the first direction; and an adhesive film that attaches the optical path block to the PIC chip in the first direction. The adhesive film may include at least one opening that is configured to pass light.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a photonic integrated circuit (PIC) chip; an electronic integrated circuit (EIC) chip on the PIC chip in a first direction; an optical path block adjacent to the EIC chip in a second direction intersecting the first direction; and an adhesive film that attaches the optical path block to the PIC chip in the first direction, wherein the adhesive film includes at least one opening that is configured to pass light.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
Publication number
US20260329029A1
Application number
19391239
Filed
Nov 17, 2025
Published
Oct 22, 2026
Inventors
2
Claims
20

Classified under

G02B 6/4212 Physics & computingG02B 6/122 Physics & computingG02B 6/4206 Physics & computingG02B 6/4239 Physics & computingG02B 6/4244 Physics & computingH10D 80/30 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.