Samsung patents chip design that keeps light signals from scattering
Samsung describes a semiconductor package that combines a chip for processing light with a standard electronic chip. It adds a special coating layer around the light-carrying parts to stop signals from scattering, while a molding layer protects the outside.
In the filing’s own words
A photonic chip structure includes a photonic integrated circuit chip, an electronic integrated circuit chip connected to the photonic integrated circuit chip, a photonic block on the photonic integrated circuit chip and configured to provide a path for optical signals, a coating layer on at least a side surface of the photonic block and configured to suppress scattering of optical signals inside the photonic block, and a molding layer on the photonic integrated circuit chip and a side surface of the photonic block, the coating layer being between the molding layer and the photonic block.
What exactly they claim (claim 1)
1. A photonic chip structure comprising: a photonic integrated circuit chip; an electronic integrated circuit chip connected to the photonic integrated circuit chip; a photonic block on the photonic integrated circuit chip and provides a path for optical signals; a coating layer on at least a side surface of the photonic block and suppresses scattering of optical signals inside the photonic block; and a molding layer on the photonic integrated circuit chip and a side surface of the photonic block, the coating layer being between the molding layer and the photonic block.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- PHOTONIC CHIP STRUCTURE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number
- US20260329026A1
- Application number
- 19649856
- Filed
- Apr 16, 2026
- Published
- Oct 22, 2026
- Inventors
- 1
- Claims
- 20
Classified under
G02B 6/4206 Physics & computingG02B 6/4212 Physics & computingG02B 6/4255 Physics & computingG02B 6/426 Physics & computingG02B 6/4274 Physics & computingH10W 70/611 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.