Samsung patents oven door that vents heat when cooking
Samsung has filed a patent for an oven that manages heat through its door. The design includes a duct with a hole that opens automatically when the inside gets hot to release trapped air, then closes when the temperature drops.
In the filing’s own words
A cooking apparatus may include: a main body; a cooking room inside the main body; a door configured to open and close to respectively open and close the cooking room, the door including a door duct having a discharge hole through which air inside the door is dischargeable to outside of the door; and a controller configured to: based on an internal temperature of the cooking room being greater than or equal to a temperature, open the discharge hole such that the air inside the door is dischargeable to the outside of the door, and based on the internal temperature being less than the temperature, close the discharge hole such that the air inside the door is prevented from being discharged to the outside of the door.
What exactly they claim (claim 1)
1. A cooking apparatus comprising: a main body; a cooking room inside the main body; a door configured to open and close to respectively open and close the cooking room, the door including a door duct having a discharge hole through which air inside the door is dischargeable to outside of the door; and a controller configured to: based on an internal temperature of the cooking room being greater than or equal to a temperature, open the discharge hole such that the air inside the door is dischargeable to the outside of the door, and based on the internal temperature being less than the temperature, close the discharge hole such that the air inside the door is prevented from being discharged to the outside of the door.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- COOKING APPARATUS AND METHOD OF CONTROLLING THE COOKING APPARATUS
- Publication number
- US20260328401A1
- Application number
- 19529494
- Filed
- Feb 4, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 15
Classified under
F24C 15/2021 Mechanical engineeringF24C 15/022 Mechanical engineeringF24C 15/2007 Mechanical engineeringF24C 15/322 Mechanical engineeringMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.