Samsung patents heated gas lines for chip making
Samsung describes a chip-making setup that heats the pipes and tanks used to deliver gas to a processing chamber. The system uses sensors to monitor temperature and pressure, adjusting the heating and valves to keep conditions stable.
In the filing’s own words
A semiconductor manufacturing apparatus includes a process chamber configured to perform a semiconductor manufacturing process, a first gas line configured to provide a reaction gas, a gas tank coupled with the first gas line, the gas tank comprising a measurement device, a second gas line coupling the process chamber with the gas tank, a gas valve on the second gas line, a heating device provided to enclose at least a portion of each of the gas tank, the first gas line, and the second gas line, a temperature control device coupled with the heating device and a valve control device coupled with the measurement device and the gas valve, where the temperature control device is configured to receive temperature information from the heating device and control the heating device based on the temperature information.
What exactly they claim (claim 1)
1. A semiconductor manufacturing apparatus, comprising: a process chamber configured to perform a semiconductor manufacturing process; a first gas line configured to provide a reaction gas; a gas tank coupled with the first gas line, the gas tank comprising a measurement device; a second gas line coupling the process chamber with the gas tank; a gas valve on the second gas line; a heating device provided to enclose at least a portion of each of the gas tank, the first gas line, and the second gas line; a temperature control device coupled with the heating device; and a valve control device coupled with the measurement device and the gas valve, wherein the temperature control device is configured to receive temperature information from the heating device and control the heating device based on the temperature information, and wherein the valve control device is configured to receive pressure information from the measurement device and control the gas valve based on the pressure information.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR MANUFACTURING APPARATUS, GAS SUPPLYING METHOD USING THE SAME, AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME
- Publication number
- US20260327802A1
- Application number
- 19724032
- Filed
- Jun 29, 2026
- Published
- Oct 22, 2026
- Inventors
- 5
- Claims
- 15
Classified under
C23C 16/45561 Chemistry & metalsC23C 16/52 Chemistry & metalsH10B 41/27 Electricity & electronicsH10B 43/27 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.