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Samsung patents chip-making tube with spray nozzle for sealing rings

Patent drawing
Patent drawing from the official filing.

Samsung has filed a patent for a machine used to process semiconductor wafers. The design adds a spray pipeline inside the processing tube that directs fluid onto the sealing rings to maintain a proper seal.

Why it mattersThis is a routine improvement to semiconductor manufacturing equipment that helps ensure the internal environment remains stable during chip production.

In the filing’s own words

A substrate processing apparatus may include: a process tube including an opened lower end; a sealing plate at a lower side of the process tube; a boat on an upper side of the sealing plate in a first direction, the boat configured to accommodate a plurality of substrates; at least one sealing ring connected to an upper surface of the sealing plate; and a spray pipeline on the upper surface of the sealing plate. The spray pipeline may include at least one spray opening that faces the at least one sealing ring, and the spray pipeline may be configured to spray a fluid, via the at least one spray opening, towards the at least one sealing ring.

What exactly they claim (claim 1)

1. A substrate processing apparatus comprising: a process tube including an opened lower end; a sealing plate at a lower side of the process tube; a boat on an upper side of the sealing plate in a first direction, the boat configured to accommodate a plurality of substrates; at least one sealing ring connected to an upper surface of the sealing plate; and a spray pipeline on the upper surface of the sealing plate, wherein the spray pipeline includes at least one spray opening that faces the at least one sealing ring, and the spray pipeline is configured to spray a fluid, via the at least one spray opening, towards the at least one sealing ring.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SUBSTRATE PROCESSING APPARATUS INCLUDING SPRAY PIPELINE
Publication number
US20260327792A1
Application number
19572292
Filed
Mar 19, 2026
Published
Oct 22, 2026
Inventors
1
Claims
20

Classified under

C23C 16/4404 Chemistry & metalsC23C 16/4409 Chemistry & metals
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.