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Samsung patents slurry mix for polishing semiconductor wafers

Patent drawing from the official filing.

Samsung has filed a patent for a liquid mixture used to smooth the surfaces of semiconductor chips. The formula combines a flat, sheet-like material with tiny hard particles and larger, softer particles to help clean and polish the wafer surface during manufacturing.

Why it mattersThis is a specific improvement to the chemical process used to make computer chips, which helps ensure the final product has a smooth, defect-free surface.

In the filing’s own words

Embodiments provides a polishing slurry including a composite of a two-dimensional material and nano-abrasives, and auxiliary particles, where an average size of the auxiliary particles is larger than an average size of the nano-abrasives, and the auxiliary particles have lower hardness than the nano-abrasives, and a method of manufacturing a semiconductor device.

What exactly they claim (claim 1)

1. A polishing slurry comprising: a composite of a two-dimensional material and nano-abrasives, and auxiliary particles, wherein an average size of the auxiliary particles is larger than an average size of the nano-abrasives, and the auxiliary particles have lower hardness than the nano-abrasives.

Facts

Company: Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title: POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number: US20260327457A1
Application number: 19636188
Filed: Apr 1, 2026
Published: Oct 22, 2026
Inventors: 4
Claims: 20

Classified under

C09G 1/02 Chemistry & metalsC09K 3/1436 Chemistry & metalsH10P 52/403 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.