Samsung patents liquid mix to polish chips with softer particles
Samsung has filed a patent for a liquid mixture used to smooth out semiconductor wafers. The mix contains hard abrasive particles to remove material, along with softer, flat organic particles that help control the process. This combination is designed to make the final chip surface smoother and more uniform.
In the filing’s own words
The present disclosure relates to a polishing slurry comprising an abrasive, plate-shaped organic particles having a hardness lower than the abrasive, and a dispersion medium, and a method of manufacturing a semiconductor device using the polishing slurry.
What exactly they claim (claim 1)
1. A polishing slurry comprising: an abrasive, plate-shaped organic particles, the plate-shaped organic particles having a lower hardness than the abrasive, and a dispersion medium.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number
- US20260327087A1
- Application number
- 19635890
- Filed
- Apr 1, 2026
- Published
- Oct 22, 2026
- Inventors
- 6
- Claims
- 20
Classified under
C01G 1/02 Chemistry & metalsH10P 52/402 Electricity & electronicsH10P 52/403 Electricity & electronicsH10P 52/407 Electricity & electronicsH10P 52/409 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.