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Samsung patents chip transfer method for display manufacturing

Patent drawing from the official filing.

Samsung has filed a patent for a method to move tiny semiconductor chips onto display circuit boards using a specialized substrate. The process involves placing chips in grooves on a base plate, using a liquid absorber to pick them up, and transferring them to a driving circuit.

Why it mattersThis filing describes a specific industrial technique for assembling display components, which is relevant to manufacturers but not directly visible to end consumers.

In the filing’s own words

Provided is a micro semiconductor chip transfer substrate including a base substrate, guide rails provided on the base substrate extending in a direction parallel to each other and spaced apart from each other, and a plurality of grooves provided in the base substrate between the guide rails and configured to accommodate micro semiconductor chips.

What exactly they claim (claim 1)

1. A method of manufacturing a display apparatus, the method comprising: preparing a base substrate comprising a plurality of grooves; forming guide rails on the base substrate, the guide rails being spaced apart from each other and parallel to each other; supplying a liquid to the plurality of grooves in the base substrate; supplying micro semiconductor chips to the base substrate; first transferring the micro semiconductor chips with the plurality of grooves by scanning the base substrate between the guide rails with a liquid absorber configured to absorb the liquid, and second transferring the micro semiconductor chips to a driving circuit board that comprises a driving circuit.

Facts

Company: Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title: MICRO SEMICONDUCTOR CHIP TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING DISPLAY APPARATUS
Publication number: US20260324505A1
Application number: 19467277
Filed: Feb 2, 2026
Published: Oct 15, 2026
Inventors: 7
Claims: 16

Classified under

H10W 90/00 Electricity & electronicsH10H 20/01 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.