Samsung patents chip package with two different plastic layers
Samsung describes a semiconductor package design that uses two distinct plastic molding layers around a central chip structure. The outer layer is made of a material that expands less when heated than the inner layer, which helps manage stress during temperature changes.
In the filing’s own words
A semiconductor package including an intermediate redistribution structure with a first thickness, a first package structure comprising a first molding layer that is in contact with a back side of the intermediate redistribution structure, a second package structure comprising a second molding layer that is in contact with a front side that is opposite to the back side of the intermediate redistribution structure, and a first redistribution structure that is in contact with a front side of the second molding layer and with a second thickness that is thicker than the first thickness, wherein the second molding layer has a thermal expansion coefficient that is less than a thermal expansion coefficient of the first molding layer.
What exactly they claim (claim 1)
1. A semiconductor package comprising: an intermediate redistribution structure with a first thickness; a first package structure comprising a first molding layer that is in contact with a back side of the intermediate redistribution structure; a second package structure comprising a second molding layer that is in contact with a front side that is opposite to the back side of the intermediate redistribution structure; and a first redistribution structure that is in contact with a front side of the second molding layer and with a second thickness that is thicker than the first thickness, wherein a thermal expansion coefficient of the second molding layer is less than a thermal expansion coefficient of the first molding layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE MOLDING LAYERS
- Publication number
- US20260324494A1
- Application number
- 19414712
- Filed
- Dec 10, 2025
- Published
- Oct 15, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 74/473 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 72/823 Electricity & electronicsH10W 90/24 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.