Samsung patents chip layout that hides wiring to cut noise
Samsung describes a semiconductor package where a control chip and a memory chip sit on a shared base. The electrical wires connecting them are placed underneath the chips, covering the connection points to reduce signal interference.
In the filing’s own words
A semiconductor package includes a substrate, and a control chip and a memory chip provided on an upper surface of the substrate. The substrate includes an insulating pattern, and a connection pattern provided on an upper surface of the insulating pattern. The connection pattern electrically connects the control chip and the memory chip, and on a plan view, the connection pattern overlaps a lower surface of the control chip and a lower surface of the memory chip.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a substrate; and a control chip and a memory chip on an upper surface of the substrate, wherein the substrate comprises: an insulating pattern; and a connection pattern on an upper surface of the insulating pattern, wherein the connection pattern electrically connects the control chip and the memory chip, and wherein at least a portion of the connection pattern is covered by a lower surface of the control chip and a lower surface of the memory chip.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING NOISE REDUCING STRUCTURE
- Publication number
- US20260324472A1
- Application number
- 19424995
- Filed
- Dec 18, 2025
- Published
- Oct 15, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 70/654 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/687 Electricity & electronicsH10W 90/10 Electricity & electronicsH10W 90/754 Electricity & electronicsH10B 80/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.