Samsung patents chip package with uneven metal shield
Samsung describes a semiconductor package design where a metal shield surrounds a computer chip. The filing specifies that the side walls of this shield have a different thickness than the top cover.
In the filing’s own words
A semiconductor package includes: a first redistribution layer including a first wiring; a die located on the first redistribution layer; and a shielding structure including a shielding wall surrounding side surfaces of the die and a shielding cover surrounding an upper surface of the die, wherein the shielding wall has a first thickness, wherein the shielding cover has a second thickness, and wherein the first thickness is different from the second thickness.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a first redistribution layer including a first wiring; a die located on the first redistribution layer; and a shielding structure including a shielding wall surrounding side surfaces of the die and a shielding cover surrounding an upper surface of the die, wherein the shielding wall has a first thickness, wherein the shielding cover has a second thickness, and wherein the first thickness is different from the second thickness.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260324437A1
- Application number
- 19723193
- Filed
- Jun 29, 2026
- Published
- Oct 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 42/20 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/114 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/401 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.