Samsung patents chip stack design with side heat sinks
Samsung describes a semiconductor package where two computer chips are stacked vertically to save space. The design adds a heat-dissipating unit on the side of the smaller chip and connects it to a metal structure to move heat away from the stack.
In the filing’s own words
A semiconductor package includes a first redistribution structure, a first die above the first redistribution structure, a second die above the first die, a heat dissipation unit on side surfaces of the first die or the second die, and a second redistribution structure above the second die. The semiconductor package includes a first post protruding from an upper surface of the first redistribution structure and extending to a lower surface of the second redistribution structure, a second post connecting the heat dissipation unit with a heat dissipation redistribution structure as a thermal path, and a molding unit filling an empty space between the first redistribution structure and the second redistribution structure. An outer pad of the heat dissipation redistribution structure is exposed to an outside of the semiconductor package, and an inner pad of the heat dissipation redistribution structure is in contact with the second post.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor package, the method comprising: positioning a first redistribution structure on a carrier; positioning a first post on the first redistribution structure; positioning a first die on the first redistribution structure, the first die including an active surface having a first area; positioning a second die on an upper surface of the first die, the second die including an active surface having a second area; positioning a heat dissipation unit on side surfaces of whichever one of the first die and the second die has an active surface with a smaller area; positioning a second post on a surface of the heat dissipation unit, the second post connecting the heat dissipation unit with a heat dissipation redistribution structure as a thermal path; forming a molding unit on the first redistribution structure; and positioning a second redistribution structure on the molding unit; wherein the heat dissipation redistribution structure is whichever one of the first redistribution structure and the second redistribution structure is closer to the heat dissipation unit, and wherein the heat dissipation unit includes silicon having a thermal conductivity higher than a thermal conductivity of the molding unit.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260324418A1
- Application number
- 19466063
- Filed
- Jan 30, 2026
- Published
- Oct 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 40/228 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 40/253 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 70/66 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.