Samsung patents chip stack with angled heat sink to cool lower layers
Samsung describes a semiconductor package where two chips are stacked vertically. A heat dissipation structure sits between them with an angled top surface to help move heat away from the lower chip without blocking the upper one.
In the filing’s own words
A semiconductor package includes a lower package including: a lower package substrate; and a lower semiconductor device above the lower package substrate; an upper package on the lower package in a first direction intersecting with an upper surface of the lower package, the upper package including: an upper package substrate on the upper surface of the lower package; and an upper semiconductor device above an upper surface of the upper package substrate; and a heat dissipation structure above the lower package and spaced apart from the upper semiconductor device in a second direction intersecting with the first direction. An upper surface of the heat dissipation structure is inclined at a an angle with respect to the upper semiconductor device.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a lower package comprising: a lower package substrate; and a lower semiconductor device above the lower package substrate; an upper package on the lower package in a first direction intersecting with an upper surface of the lower package, the upper package comprising: an upper package substrate on the upper surface of the lower package; and an upper semiconductor device above an upper surface of the upper package substrate; and a heat dissipation structure above the lower package and spaced apart from the upper semiconductor device in a second direction intersecting with the first direction, wherein an upper surface of the heat dissipation structure is inclined at an angle with respect to the upper semiconductor device.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260324415A1
- Application number
- 19367313
- Filed
- Oct 23, 2025
- Published
- Oct 15, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 40/22 Electricity & electronicsH10W 72/50 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/701 Electricity & electronicsH10P 54/00 Electricity & electronicsH10W 46/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.