Samsung patents chip wiring with textured protective coating
Samsung describes a semiconductor design where a protective film covers the sides of electrical wiring. This film has a flat base layer plus small bumps that stick out from the surface. The filing says this structure helps improve the performance and reliability of the chip.
In the filing’s own words
To improve element performance and reliability by forming an air gap and a wiring protective film on a side wall of a wiring structure, a semiconductor device may include a lower conductive pattern, a wiring structure on the lower conductive pattern, extending in a first direction, and including upper and bottom surfaces opposing each other in a second direction, the bottom surface of the wiring structure facing the lower conductive pattern, a side wall of the wiring structure connecting the upper and bottom surfaces of the wiring structure, and a first wiring protective film in contact with the wiring structure, and extending along the side wall of the wiring structure, in which the first wiring protective film includes a cover region covering the side wall of the wiring structure, and a plurality of protruding regions, each of which protrudes from the cover region in a third direction.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a lower conductive pattern; a first wiring structure which is disposed on the lower conductive pattern, extends in a first direction, and includes an upper surface and a bottom surface that are opposite to each other in a second direction different from the first direction, the bottom surface of the first wiring structure facing the lower conductive pattern, the first wiring structure further including a side wall connecting the upper surface of the first wiring structure and the bottom surface of the first wiring structure; and a first wiring protective film which is in contact with the first wiring structure, and extends along the side wall of the first wiring structure, wherein the first wiring protective film includes a cover region that covers the side wall of the first wiring structure, and a plurality of protruding regions, and each of the plurality of protruding regions of the first wiring protective films protrude from the cover region of the first wiring protective film in a third direction different from the first direction and the second direction.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING WIRING PROTECTIVE FILM AND METHOD FOR FABRICATING THEREOF
- Publication number
- US20260324408A1
- Application number
- 19443707
- Filed
- Jan 8, 2026
- Published
- Oct 15, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 20/455 Electricity & electronicsH10W 20/43 Electricity & electronicsH10W 20/435 Electricity & electronicsH10W 20/46 Electricity & electronicsH10W 20/47 Electricity & electronicsH10W 20/48 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.