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Samsung patents semiconductor metal lines with two-layer structure

Patent drawing
Patent drawing from the official filing.

Samsung describes a semiconductor device where metal lines on a base layer are built from two stacked metal structures. The second metal structure sits directly on top of and touches the first one.

Why it mattersThis is a standard improvement in chip manufacturing that helps engineers build more reliable connections inside computer chips.

In the filing’s own words

A semiconductor device may include a base layer and at least one metal line on the base layer. Each of the at least one metal line includes a 1 st metal structure and a 2 nd metal structure on the 1 st metal structure. The 2 nd metal structure is in contact with the 1 st metal structure.

What exactly they claim (claim 1)

1. A semiconductor device comprising: a base layer; and at least one metal line on the base layer, wherein each of the at least one metal line comprises a 1 st metal structure and a 2 nd metal structure on the 1 st metal structure, and wherein the 2 nd metal structure contacts the 1 st metal structure.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE INCLUDING METAL LINES HAVING MULTI-LAYER STRUCTURE
Publication number
US20260324380A1
Application number
19706851
Filed
Jun 12, 2026
Published
Oct 15, 2026
Inventors
3
Claims
9

Classified under

H10W 20/057 Electricity & electronicsH10W 20/033 Electricity & electronicsH10W 20/4421 Electricity & electronicsH10W 20/4441 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.