Samsung patents laser method for cutting chips in semiconductors
Samsung describes a method for cutting computer chips out of a silicon wafer using two different laser beams. The first laser creates a small groove in a protective layer on the back of the wafer, while a second laser with a longer wavelength travels through that groove to create a crack inside the chip material. This crack allows the individual chips to be separated from the wafer.
In the filing’s own words
Forming a backside layer on a backside of the wafer, forming a recess in the backside layer by emitting a first laser beam onto the backside layer, forming an inner crack inside the wafer by emitting a second laser beam into the wafer through the backside that overlaps the recess, the second laser beam having a wavelength longer than a wavelength of the first laser beam, and separating the chip regions from each other using the inner crack.
What exactly they claim (claim 1)
1. A wafer cutting method comprising: forming a backside layer on a backside of a wafer, wherein the wafer comprises chip regions and a scribe lane region spacing the chip regions apart from one another; forming a recess in the backside layer by emitting a first laser beam onto the backside layer; forming an inner crack inside the wafer by emitting a second laser beam into the wafer through the backside, wherein the inner crack vertically overlaps the recess, wherein the second laser beam has a wavelength longer than a wavelength of the first laser beam; and separating the chip regions from each other using the inner crack.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- MANUFACTURING SEMICONDUCTOR DEVICES USING A LASER
- Publication number
- US20260324332A1
- Application number
- 19563799
- Filed
- Mar 11, 2026
- Published
- Oct 15, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10P 54/30 Electricity & electronicsB23K 26/0648 Operations & transportB23K 26/364 Operations & transportB23K 26/53 Operations & transportB23K 26/60 Operations & transportH10P 54/20 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.