Samsung patents chip layer to improve transistor performance
Samsung has filed a patent for a semiconductor design that adds a specific layer to the channel of a transistor. This layer, made from materials like titanium or silicon, is placed on the surface of the channel to influence how the device operates.
In the filing’s own words
Provided are semiconductor devices, electronic apparatuses including the semiconductor device, and methods of manufacturing the semiconductor device. The semiconductor device includes a channel including a first surface and a second surface opposing the first surface, a source electrode electrically connected to the channel, a drain electrode electrically connected to the channel and being apart from the source electrode, a gate insulating layer above the channel, a gate electrode on the gate insulating layer, and a reduction-inducing layer on at least one selected from the first surface and the second surface of the channel.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a channel comprising a first surface and a second surface opposing the first surface; a source electrode electrically connected to the channel; a drain electrode electrically connected to the channel and being apart from the source electrode; a gate insulating layer above the channel; a gate electrode on the gate insulating layer; and a reduction-inducing layer on at least one selected from the first surface and the second surface of the channel, wherein the reduction-inducing layer comprises M or MO, and M comprises at least one selected from Ti, Sc, Ce, Si, and V.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
- Publication number
- US20260323992A1
- Application number
- 19425293
- Filed
- Dec 18, 2025
- Published
- Oct 15, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10D 30/6706 Electricity & electronicsH10D 30/031 Electricity & electronicsH10D 30/6755 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
