Samsung patents memory chip layout using a honeycomb pattern
Samsung describes a design for a semiconductor memory device where connection points, called landing pads, are arranged in a honeycomb shape. This layout connects specific parts of the chip, known as active patterns, to the underlying electrodes to store data.
In the filing’s own words
A semiconductor memory device includes bit lines extending in a first direction on a substrate, first and second active patterns alternately arranged along the first direction on each of the bit lines, back gate electrodes disposed on the bit lines and extending in a second direction between the first and second active patterns adjacent to each other, first word lines adjacent to the first active patterns, respectively, and extending in the second direction, second word lines adjacent to the second active patterns, respectively, and extending in the second direction, landing pads connected to the first and second active patterns, respectively, and lower electrodes connected to the landing pads, respectively, wherein the landing pads are arranged in a honeycomb structure.
What exactly they claim (claim 1)
1. A semiconductor memory device comprising: bit lines extending in a first direction on a substrate; first and second active patterns alternately arranged along the first direction on each of the bit lines; back gate electrodes disposed on the bit lines and extending in a second direction between the first and second active patterns adjacent to each other; first word lines adjacent to the first active patterns, respectively, and extending in the second direction; second word lines adjacent to the second active patterns, respectively, and extending in the second direction; landing pads connected to the first and second active patterns, respectively; and lower electrodes connected to the landing pads, respectively, wherein the landing pads are arranged in a honeycomb structure.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number
- US20260323924A1
- Application number
- 19712596
- Filed
- Jun 18, 2026
- Published
- Oct 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10B 12/482 Electricity & electronicsH10B 12/05 Electricity & electronicsH10B 12/315 Electricity & electronicsH10B 12/488 Electricity & electronicsH10B 12/50 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.