Samsung patents phone design with sealed holes for external connections
Samsung has filed a patent for an electronic device that uses a layered structure to connect internal parts to the outside. The design features a metal plate and a squishy sealing material around specific holes to keep the device secure while allowing components to pass through.
In the filing’s own words
An electronic device may include a first cover closing a first opening of a housing and including a first through hole, a substrate disposed in the housing and having a third surface facing the second surface and a fourth surface opposite to the third surface and including a second through hole aligned with the first through hole, a first electrical component disposed on the substrate and connected outside of the electronic device through the first and second through holes, a compressible sealing member disposed between the third surface and the second surface surrounding the first and second through holes, and a metal plate at least partially disposed between the compressible sealing member and the second surface and including a third through hole aligned with the first and second through holes, and the first electrical component may be connected outside the electronic device through the first, second, and third through holes.
What exactly they claim (claim 1)
1. An electronic device, comprising: a housing including a first opening; a first cover attached to an outer surface of the housing to close the first opening, and including a first through hole formed from a first surface facing an outside of the housing to a second surface opposite to the first surface; a substrate disposed in the housing, and including a second through hole formed from a third surface facing the second surface to a fourth surface opposite to the third surface, the second through hole being aligned with the first through hole; a first electrical component disposed on the substrate and connected with an outside of the electronic device through the first through hole and the second through hole; a compressible sealing member disposed between the third surface and the second surface to surround the first through hole and the second through hole; and a metal plate disposed at least partially between the compressible sealing member and the second surface, and including a third through hole aligned with the first through hole and the second through hole, wherein the first electrical component is connected with the outside of the electronic device through first, second, and third through holes.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- ELECTRONIC DEVICE INCLUDING ACOUSTIC MODULE
- Publication number
- US20260323198A1
- Application number
- 19644212
- Filed
- Apr 10, 2026
- Published
- Oct 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H04R 1/086 Electricity & electronicsH04R 1/028 Electricity & electronicsH04R 2499/11 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.