SamsungPatent applicationChips & hardwareInterest 4/10

Samsung patents RF chip design that shares parts between signal paths

Patent drawing from the official filing.

Samsung describes a radio frequency integrated circuit that uses switches to connect a specific part of one signal path to a capacitor in another path. This allows the chip to share components between different radio frequency chains instead of duplicating them.

Why it mattersSharing components in a chip can reduce its size and cost, which is a standard engineering improvement for making phones and other devices more efficient.

In the filing’s own words

A radio frequency integrated circuit (RFIC) including a plurality of radio frequency (RF) chains includes a first RF chain and a second RF chain differing from the first RF chain, and a target circuit included in the first RF chain is selectively connected to at least one shared capacitor included in the second RF chain by using a plurality of switch elements.

What exactly they claim (claim 1)

1. A radio frequency integrated circuit (RFIC) comprising: a first radio frequency (RF) chain; and a second RF chain different from the first RF chain, wherein a target circuit in the first RF chain is selectively connected to at least one shared capacitor in the second RF chain through a plurality of switch elements.

Facts

Company: Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title: RADIO FREQUENCY INTEGRATED CIRCUIT AND OPERATING METHOD THEREOF, AND ELECTRONIC DEVICE
Publication number: US20260322417A1
Application number: 19644288
Filed: Apr 10, 2026
Published: Oct 15, 2026
Inventors: 7
Claims: 20

Classified under

H04B 1/40 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.