SamsungPatent applicationChips & hardwareInterest 6/10

Samsung patents chip that fixes its own broken parts

Patent drawing from the official filing.

Samsung has filed a patent for an integrated circuit that can identify and fix defective components within itself. The design uses specific memory elements to store repair instructions, allowing a control circuit to bypass or replace faulty hardware resources during operation.

Why it mattersThis technology could help manufacturers produce more reliable chips by automatically correcting minor manufacturing defects, potentially reducing waste and improving the lifespan of electronic devices.

In the filing’s own words

The present disclosure relates to an integrated circuit including hardware resources. An example integrated circuit includes at least one first flipflop configured to latch scan data output from the integrated circuit in a first mode and to latch repair data in a second mode, and a control circuit configured to repair a defective resource among the hardware resources based on the repair data latched by the at least one first flipflop in the second mode.

What exactly they claim (claim 1)

1. An integrated circuit comprising a plurality of hardware resources, the integrated circuit comprising: at least one first flipflop configured to latch scan data in a first mode and to latch repair data in a second mode, the scan data being output from the integrated circuit; and a control circuit configured to repair a defective resource among the plurality of hardware resources based on the repair data latched by the at least one first flipflop in the second mode.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: INTEGRATED CIRCUIT PROVIDING BUILT-IN SELF-REPAIR AND METHOD THEREFOR
Publication number: US20260319882A1
Application number: 19535727
Filed: Feb 10, 2026
Published: Oct 15, 2026
Inventors: 4
Claims: 20

Classified under

G06F 11/0793 Physics & computingG01R 31/3177 Physics & computingG06F 11/0721 Physics & computing

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.