Samsung patents test socket design to reduce contact area with chips
Samsung has filed a patent for a test socket used to check semiconductor packages. The design features a floating plate with both thin and thick sections that align with holes in a base plate to hold testing pins.
In the filing’s own words
A test socket includes a base plate defining first through-holes, and a floating plate over the base plate and defining second through-holes vertically overlapping the respective first through-holes. The floating plate includes a thin portion and a thick portion having a thickness greater than a thickness of the thin portion. The test socket further includes socket pins in the first through-holes and the second through-holes. The first through-holes and the second through-holes vertically overlap each other with the socket pins therein.
What exactly they claim (claim 1)
1. A test socket comprising: a base plate defining first through-holes; a floating plate over the base plate, the floating plate defining second through-holes configured to vertically overlap the respective first through-holes, wherein the floating plate includes a thin portion and a thick portion having a thickness greater than a thickness of the thin portion; and socket pins in the first through-holes and the second through-holes, the first through-holes and the second through-holes vertically overlapping with each other.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- TEST APPARATUS FOR REDUCING A CONTACT AREA BETWEEN A TEST SOCKET AND A SEMICONDUCTOR PACKAGE
- Publication number
- US20260318948A1
- Application number
- 19467002
- Filed
- Feb 2, 2026
- Published
- Oct 15, 2026
- Inventors
- 2
- Claims
- 20
Classified under
G01R 1/0408 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.