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Samsung patents ultrasonic tool to test semiconductor wafers

Patent drawing
Patent drawing from the official filing.

Samsung has filed a patent for a machine that checks the quality of semiconductor wafers using sound waves. The device sends ultrasonic waves through a stage and uses a probe that fits into a hole in the wafer to receive the signal.

Why it mattersThis improves the precision of quality control during chip manufacturing, helping ensure that only sound wafers move to the next stage of production.

In the filing’s own words

An apparatus for testing a semiconductor device includes a stage configured to support a substrate, an ultrasonic wave transmitting device configured to transmit an ultrasonic wave toward the stage, and an ultrasonic wave receiving device disposed on the stage. The ultrasonic wave receiving device comprises an aperture configured to be disposed on a surface of the substrate on the stage, and an ultrasonic wave receiving probe disposed to pass through the aperture and to contact the substrate on the stage when the substrate is on the stage.

What exactly they claim (claim 1)

1. An apparatus for testing a semiconductor device, comprising: a stage configured to support a substrate; an ultrasonic wave transmitting device configured to transmit an ultrasonic wave toward the stage; and an ultrasonic wave receiving device disposed on the stage, wherein the ultrasonic wave receiving device comprises: an aperture configured to be disposed on a surface of the substrate on the stage; and an ultrasonic wave receiving probe disposed to pass through the aperture and to contact the substrate on the stage when the substrate is on the stage.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE TESTING APPARATUS
Publication number
US20260318875A1
Application number
19720083
Filed
Jun 25, 2026
Published
Oct 15, 2026
Inventors
4
Claims
20

Classified under

G01N 29/043 Physics & computingG01N 29/24 Physics & computingG01N 29/265 Physics & computingH10P 74/23 Electricity & electronicsG01N 2291/0289 Physics & computing
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.