Samsung patents chip stacking design with offset layers
Samsung describes a semiconductor package where multiple chips are stacked in two groups, with the second group shifted slightly relative to the first. This offset arrangement allows the chips to sit on a base with pads arranged in two distinct rows.
In the filing’s own words
A semiconductor package includes a package substrate, at least one first semiconductor chip offset-stacked in a first direction on the package substrate, first semiconductor chip pads on a top surface of each of the at least one first semiconductor chip, at least one second semiconductor chip that is offset-stacked in the first direction on a first semiconductor chip positioned at an uppermost end of the at least one first semiconductor chip, second semiconductor chip on a top surface of each of the at least one second semiconductor chip, and a plurality of substrate pads arranged in two rows on the package substrate, where a second semiconductor chip positioned at a lowermost end of the at least one second semiconductor chip is offset-stacked in the first and second directions with the first semiconductor chip positioned at the uppermost end.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a package substrate; one or more first semiconductor chips offset-stacked in a first direction on the package substrate; a plurality of first semiconductor chip pads spaced apart from each other in a second direction on an upper surface of each of the one or more first semiconductor chips; one or more second semiconductor chips offset-stacked in the first direction on an uppermost first semiconductor chip of the one or more first semiconductor chips; a plurality of second semiconductor chip pads spaced apart from each other in the second direction on an upper surface of each of the one or more second semiconductor chips; and a plurality of substrate pads arranged in a first row and a second row on the package substrate, wherein a lowermost second semiconductor chip of the one or more second semiconductor chips is offset-stacked, in the first direction and the second direction, on the uppermost first semiconductor chip.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260314508A1
- Application number
- 19640701
- Filed
- Apr 7, 2026
- Published
- Oct 8, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 90/792 Electricity & electronicsH10W 90/24 Electricity & electronicsH10W 90/762 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.