Samsung patents chip stack with built-in power capacitor
Samsung describes a semiconductor package where multiple chips are stacked vertically. The top of this stack includes a dummy chip that holds a capacitor to help manage power delivery.
In the filing’s own words
A semiconductor package including a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip in a first direction perpendicular to an upper surface of the first semiconductor chip, an upper semiconductor chip stacked on the uppermost second semiconductor chip among the plurality of second semiconductor chips, and a dummy semiconductor chip stacked on the upper semiconductor chip and including a capacitor. The upper semiconductor chip includes an upper through via that passes through at least a portion of the upper semiconductor chip and is electrically connected to the capacitor.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a first semiconductor chip; a plurality of second semiconductor chips stacked on the first semiconductor chip in a first direction perpendicular to an upper surface of the first semiconductor chip; an upper semiconductor chip stacked on an uppermost second semiconductor chip among the plurality of second semiconductor chips; and a dummy semiconductor chip stacked on the upper semiconductor chip and including a capacitor, wherein the upper semiconductor chip comprises an upper through via electrically connected to the capacitor.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE INCLUDING POWER SUPPLY CAPACITOR
- Publication number
- US20260314504A1
- Application number
- 19413436
- Filed
- Dec 9, 2025
- Published
- Oct 8, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 90/297 Electricity & electronicsH10W 90/26 Electricity & electronicsH10W 90/275 Electricity & electronicsH10W 90/792 Electricity & electronicsH10W 90/798 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.