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Samsung patents chip design to stop warping

Patent drawing
Patent drawing from the official filing.

Samsung has filed a patent for a semiconductor device that uses a specific insulating structure to reduce warping in the chip. The design features a two-part insulating layer between electrical connections, where one part is narrower than the other to manage stress. This approach aims to keep the physical shape of the chip stable during manufacturing and use.

Why it mattersThis is a routine improvement in chip manufacturing that helps maintain the physical integrity of semiconductors, which is essential for reliable electronics.

In the filing’s own words

A semiconductor device includes: a substrate; a first via penetration the substrate; a second via penetrating the substrate; and an insulating pattern surrounding the first via and the second via, in which the insulating pattern comprises a first portion between the first via and the second via, the first portion comprises a first pattern portion and a second pattern portion overlapping the first pattern portion, and a width of the first pattern portion is smaller than a width of the second pattern portion.

What exactly they claim (claim 1)

1. A semiconductor device comprising: a substrate; a first via penetrating the substrate; a second via penetrating the substrate; and an insulating pattern surrounding the first via and the second via, wherein the insulating pattern comprises a first portion between the first via and the second via, wherein the first portion comprises a first pattern portion and a second pattern portion overlapping the first pattern portion, and wherein a width of the first pattern portion is smaller than a width of the second pattern portion.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE
Publication number
US20260314478A1
Application number
19382712
Filed
Nov 7, 2025
Published
Oct 8, 2026
Inventors
3
Claims
20

Classified under

H10W 74/147 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 74/01 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/26 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.