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Samsung patents semiconductor package with layered silicon oxide insulation

Samsung describes a method for building a semiconductor package by creating two distinct layers of silicon oxide insulation on a silicon base. The process involves attaching a structure to the first layer and then using a heat treatment, known as annealing, to form a second layer with a lower concentration of silicon. This specific layering aims to improve the structural integrity of the chip package.

Why it mattersThis is a routine improvement in chip manufacturing that helps protect delicate computer components, but it is unlikely to change how everyday devices look or function.

In the filing’s own words

A method for manufacturing a semiconductor package, includes forming a first insulating layer on a first substrate including silicon. The first insulating layer includes silicon oxide, and has a first concentration of silicon. The method includes attaching a structure to the first insulating layer, and forming a second insulating layer on the first insulating layer by performing an annealing process. The second insulating layer includes silicon oxide, and has a second concentration of silicon which is lower than the first concentration. The first concentration is a ratio of a weight of silicon in the first insulating layer to a total weight of the first insulating layer, the second concentration is a ratio of a weight of silicon in the second insulating layer to a total weight of the second insulating layer, and the first concentration is in a range from 20 wt % to 50 wt %.

What exactly they claim (claim 1)

1. (canceled)

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR PACKAGE
Publication number
US20260314457A1
Application number
19708065
Filed
Jun 15, 2026
Published
Oct 8, 2026
Inventors
4
Claims
21

Classified under

H10W 70/69 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 70/698 Electricity & electronicsH10W 72/353 Electricity & electronicsH10W 72/355 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.