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Samsung patents T-shaped pads to connect chips in semiconductor packages

Patent drawing
Patent drawing from the official filing.

Samsung describes a method for building a semiconductor package that uses T-shaped connecting pads to link internal components. The wider part of the T-shape sits inside a protective mold layer to hold an electronic element, while the narrower part extends through the base to connect with a solder ball.

Why it mattersThis design aims to improve how different parts of a chip package are physically and electrically connected, which is a standard engineering task in making computer hardware.

In the filing’s own words

A semiconductor package including a passivation film, a mold layer on the passivation film, a connecting pad having a T shape, the T shape including a first portion and a second portion on the first portion, the first portion penetrating the passivation film, the second portion penetrating a part of the mold layer, a solder ball on the first portion of the connecting pad, an element on the second portion of the connecting pad, a wiring structure on the mold layer, the wiring structure including an insulating layer and a wiring pattern inside the insulating layer, and a semiconductor chip on the wiring structure may be provided.

What exactly they claim (claim 1)

1. A method of manufacturing a semiconductor package, the method comprising: forming a passivation film; forming a connecting pad having a T shape, the T shape including a first portion and a second portion on the first portion, the first portion penetrating the passivation film, the second portion being on the first portion; forming a mold layer on the passivation film, the mold layer wrapping the second portion of the connecting pad; mounting an element on the second portion of the connecting pad such that the element is in the mold layer; forming a wiring structure on the mold layer, the wiring structure including an insulating layer and a wiring pattern inside the insulating layer; mounting a semiconductor chip on the wiring structure; and forming a solder ball on the first portion of the connecting pad, wherein the first portion of the connecting pad is in contact with the solder ball, wherein the second portion of the connecting pad is in contact with the element, and wherein a width of the second portion of the connecting pad in a first direction parallel to an upper surface of the passivation film is greater than a width of the first portion of the connecting pad in the first direction.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR PACKAGE INCLUDING CONNECTING PADS
Publication number
US20260314451A1
Application number
19708113
Filed
Jun 15, 2026
Published
Oct 8, 2026
Inventors
6
Claims
20

Classified under

H10W 70/65 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/131 Electricity & electronicsH10W 76/15 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/701 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.