SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents chip packaging method using thicker bonding wires

Patent drawing from the official filing.

Samsung describes a way to build semiconductor packages by coating thin metal wires with extra metal before sealing them inside a chip. The process involves attaching these reinforced wires between two layers that route electrical signals to the chip.

Why it mattersIt is a routine improvement to how computer chips are physically assembled, potentially making the connection between the chip and its circuit board more robust.

In the filing’s own words

A method of fabricating a semiconductor package, the method includes forming a bonding pad on a first redistribution layer substrate, bonding a first end of a bonding wire on the bonding pad, electroplating on the bonding wire to form a metal portion around the bonding wire, mounting a semiconductor chip on the first redistribution layer substrate, molding the metal portion and the semiconductor chip with an encapsulant, and forming a second redistribution layer substrate on the encapsulant, a second end of the bonding wire being bonded to the second redistribution layer substrate.

What exactly they claim (claim 1)

1. A method of fabricating a semiconductor package, the method comprising: forming a bonding pad on a first redistribution layer substrate; bonding a first end of a bonding wire on the bonding pad; electroplating on the bonding wire to form a metal portion around the bonding wire; mounting a semiconductor chip on the first redistribution layer substrate; molding the metal portion and the semiconductor chip with an encapsulant; and forming a second redistribution layer substrate on the encapsulant, wherein a second end of the bonding wire is bonded to the second redistribution layer substrate.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
Publication number: US20260314446A1
Application number: 19712625
Filed: Jun 18, 2026
Published: Oct 8, 2026
Inventors: 6
Claims: 20

Classified under

H10W 70/635 Electricity & electronicsH10W 20/087 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 74/016 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 72/932 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.