Samsung patents chip package with built-in heat transfer block
Samsung describes a semiconductor package design that stacks two chips vertically to save space. It uses a specific heat transfer block with a protruding section to move heat away from the top chip more efficiently.
In the filing’s own words
A semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure, a conductive pillar on the first redistribution structure and spaced from the first semiconductor chip in a horizontal direction, a molding member on the first redistribution structure and around the first semiconductor chip and the conductive pillar, a second redistribution structure on the molding member, a second semiconductor chip on the second redistribution structure, a first thermally conductive adhesive layer on the second redistribution structure, a second thermally conductive adhesive layer on an upper surface of the second semiconductor chip, and a heat transfer block on the second redistribution structure and including a protrusion portion in contact with the second thermally conductive adhesive layer, and a body portion in contact with the first thermally conductive adhesive layer.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a first redistribution structure; a first semiconductor chip on the first redistribution structure; at least one conductive pillar on the first redistribution structure and spaced apart from the first semiconductor chip in a horizontal direction; a molding member on the first redistribution structure and around the first semiconductor chip and the at least one conductive pillar; a second redistribution structure on the molding member; a second semiconductor chip on the second redistribution structure; a first thermally conductive adhesive layer on the second redistribution structure; a second thermally conductive adhesive layer on an upper surface of the second semiconductor chip; and a heat transfer block on the second redistribution structure, the heat transfer block comprising: a protrusion portion in contact with the second thermally conductive adhesive layer, and a body portion in contact with the first thermally conductive adhesive layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260314404A1
- Application number
- 19641128
- Filed
- Apr 7, 2026
- Published
- Oct 8, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 40/242 Electricity & electronicsH10W 40/235 Electricity & electronicsH10W 72/823 Electricity & electronicsH10W 74/111 Electricity & electronicsH10W 74/131 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.