Samsung patents chemical mix to clean chips without rusting tools
Samsung has filed a patent for a liquid solution used to remove unwanted material from computer chips during manufacturing. The mixture combines hydrofluoric acid with a specific chemical that prevents the metal tools from corroding while the acid does its work.
In the filing’s own words
A composition for wet etching may include HF, a corrosion inhibitor, and an aprotic organic solvent having a dielectric constant of less than or equal to 60, The corrosion inhibitor may be a polycyclic fused ring compound in which a heterocyclic ring containing one or more S atoms therein is fused to an additional ring.
What exactly they claim (claim 1)
1. A composition for wet etching, comprising HF; a corrosion inhibitor; and an aprotic organic solvent having a dielectric constant of less than or equal to 60, wherein the corrosion inhibitor is a polycyclic fused ring compound in which a heterocyclic ring containing one or more S atoms is fused to an additional ring.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- COMPOSITION FOR WET ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE COMPOSITION
- Publication number
- US20260314286A1
- Application number
- 19413240
- Filed
- Dec 9, 2025
- Published
- Oct 8, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10P 50/683 Electricity & electronicsC09K 13/08 Chemistry & metalsH10D 84/0158 Electricity & electronicsH10P 70/23 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
