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SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents chemical mix to clean chips without rusting tools

Patent drawing
Patent drawing from the official filing.

Samsung has filed a patent for a liquid solution used to remove unwanted material from computer chips during manufacturing. The mixture combines hydrofluoric acid with a specific chemical that prevents the metal tools from corroding while the acid does its work.

Why it mattersThis is a routine improvement in chip manufacturing that helps protect expensive factory equipment from damage during the cleaning process.

In the filing’s own words

A composition for wet etching may include HF, a corrosion inhibitor, and an aprotic organic solvent having a dielectric constant of less than or equal to 60, The corrosion inhibitor may be a polycyclic fused ring compound in which a heterocyclic ring containing one or more S atoms therein is fused to an additional ring.

What exactly they claim (claim 1)

1. A composition for wet etching, comprising HF; a corrosion inhibitor; and an aprotic organic solvent having a dielectric constant of less than or equal to 60, wherein the corrosion inhibitor is a polycyclic fused ring compound in which a heterocyclic ring containing one or more S atoms is fused to an additional ring.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
COMPOSITION FOR WET ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE COMPOSITION
Publication number
US20260314286A1
Application number
19413240
Filed
Dec 9, 2025
Published
Oct 8, 2026
Inventors
4
Claims
20

Classified under

H10P 50/683 Electricity & electronicsC09K 13/08 Chemistry & metalsH10D 84/0158 Electricity & electronicsH10P 70/23 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.