Samsung patents chip design using magnets to tune quantum circuits
Samsung describes a superconducting quantum chip that stacks two separate wafers with a small gap between them. A magnetic component on the top layer sends a field through the gap to adjust the frequency of the quantum circuit below.
In the filing’s own words
A superconducting quantum chip including a first chip including a superconducting quantum device having a controllable resonant frequency, a second chip bonded to the first chip with a gap defined between the first chip and the second chip, and a ferromagnetic device provided on the second chip, the ferromagnetic device being configured to apply a magnetic field to the superconducting quantum device to control a resonant frequency of the superconducting quantum device.
What exactly they claim (claim 1)
1. A superconducting quantum chip, comprising: a first chip comprising a superconducting quantum device having a controllable resonant frequency; a second chip bonded to the first chip with a gap defined between the first chip and the second chip; and a ferromagnetic device provided on the second chip, the ferromagnetic device being configured to apply a magnetic field to the superconducting quantum device to control a resonant frequency of the superconducting quantum device.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- METHOD AND APPARATUS WITH SUPERCONDUCTING QUANTUM CHIP
- Publication number
- US20260314269A1
- Application number
- 19057142
- Filed
- Feb 19, 2025
- Published
- Oct 8, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10N 60/815 Electricity & electronicsH03K 17/92 Electricity & electronicsH10N 60/805 Electricity & electronicsG06N 10/40 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
