Samsung patents chip design with stepped cutting pattern
Samsung has filed a patent for a semiconductor device that uses a specific shape to separate parts of the chip. The design features a vertical cutting pattern that is wider at the bottom and narrower at the top, creating a stepped profile between the chip's active areas.
In the filing’s own words
A semiconductor device according to the disclosed concepts includes first active patterns spaced apart from one another in a first direction, a first device isolation layer between the first active patterns adjacent to one another; first channel patterns on the first active patterns, and a cutting pattern extending vertically between the first channel patterns. The cutting pattern comprises a first portion and a second portion on the first portion. A width of the first portion is greater than a width of the second portion at a boundary between the first portion and the second portion.
What exactly they claim (claim 1)
1. A semiconductor device comprising: first active patterns spaced apart from one another in a first direction; a first device isolation layer between the first active patterns adjacent to one another; first channel patterns on the first active patterns; and a cutting pattern extending vertically between the first channel patterns, wherein the cutting pattern comprises a first portion and a second portion on the first portion, and wherein a width of the first portion is greater than a width of the second portion at a boundary between the first portion and the second portion.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING CUTTING PATTERN
- Publication number
- US20260314057A1
- Application number
- 19641036
- Filed
- Apr 7, 2026
- Published
- Oct 8, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10D 84/851 Electricity & electronicsH10D 30/43 Electricity & electronicsH10D 30/503 Electricity & electronicsH10D 30/506 Electricity & electronicsH10D 62/121 Electricity & electronicsH10D 62/151 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.